Initial commit of files
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order of copper layers:
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Copper 1: Front
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Copper 2: Inner3
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Copper 3: Inner2
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Copper 4: Back
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PCB description: 4 layer PCB 0.062 in
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Copper 1 0.5 oz foil plated to approximately 0.0017 in
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Dielectric 1-2 0.0119 in
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Copper 2 1 oz foil (0.0014 in)
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Dielectric 2-3 0.0280 in
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Copper 3 1 oz foil (0.0014 in)
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Dielectric 3-4 0.0119 in
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Copper 4 0.5 oz foil plated to approximately 0.0017 in
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FR4 or similar substrate with Er=4.5 (+/- 0.1)
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double side solder mask black
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single side silkscreen white
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6 mil min trace width and
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6 mil min isolation
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