Updated HackRF firmware

This commit is contained in:
2022-05-13 13:08:12 -04:00
parent 3618a32734
commit 8dae36514e
611 changed files with 286269 additions and 159089 deletions

View File

@ -0,0 +1,19 @@
order of copper layers:
Copper 1: Front
Copper 2: Inner3
Copper 3: Inner2
Copper 4: Back
PCB description: 4 layer PCB 0.062 in
Copper 1 0.5 oz foil plated to approximately 0.0017 in
Dielectric 1-2 0.0119 in
Copper 2 1 oz foil (0.0014 in)
Dielectric 2-3 0.0280 in
Copper 3 1 oz foil (0.0014 in)
Dielectric 3-4 0.0119 in
Copper 4 0.5 oz foil plated to approximately 0.0017 in
FR4 or similar substrate with Er=4.5 (+/- 0.1)
double side solder mask black
single side silkscreen white
6 mil min trace width and
6 mil min isolation